20 kHz vibrations from the Ultrasonic Generator via a transducer attached to the horn are transmitted to the molten solder resulting in cavitation of the molten solder. The imploding cavitation bubbles have a scrubbing effect on any submerged workpiece and mechanically remove oxides.
The cleaned surface is immediately coated with the solder in which it is immersed.

The process does not require the use of a flux which has immediate benefits in the elimination of the fluxing operation and the procedures and equipment associated not only with its application but also with storage, residue removal etc.

The soldering temperature can often be lowered simply because it is not necessary to ensure activation of a flux and this in itself reduces dross formation.

The absence of a flux and its surface tension reducing properties means that there is no "wicking" of solder in the ultrasonic soldering process. Whereas this can be a disadvantage under certain conditions it is advantageous in the tinning of stranded wires and connector pins.

The UM250 Ultrasonic Generator produces 250W of energy at 20kHz which is transmitted to the solder bath via a transducer and energy horn or acoustic probe. This horn or probe enters through the side of the solder bath and is immersed in the solder. The transducer needs to be protected in terms of temperature and the horn is therefore supplied with an air cooling collar requiring connection to a compressed air supply.

The solder bath is based on the established SP5 unit with internal dimensions of 5"(127 mm) x 3 1⁄2" (89mm) x 3 1⁄2" deep (89mm) and has an element rating of 700W and a capacity of approx. 10 kgs.

The dross that accumulates on the solder surface needs to be removed before dip soldering or tinning takes place and the solder bath is fitted with a manual blade system. This draws the dross from the solder surface onto a sloping exit plate to fall into a collection box. The solder bath temperature is controlled via a Solbraze ER6 +/- 5∞C controller (other types also available) linked to the bath by a thermocouple assembly located in a bar welded externally to bath base.

The solder bath is supplied complete with removable lid and the bath and transducer are positively located on a steel base plate to prevent relative movement between them.

Other sizes and shapes of solder bath are available - details on request.