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Dip Soldering and Tinning |
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 Dip Soldering and Tinning are processes which can be carried out manually, semi or fully automatically, using a solder pot or bath which allows immersion of the component directly into molten solder. Solder pots are available in circular form from 25 mm to 150 mm dia or rectangular from 130 mm x 90 mm x 90 mm upwards, all 90 mm deep as standard. Temperature Control facilities, built into the smaller circular pots and separately housed for larger circular and all rectangular pots, are available in a variety of types from +/- 15∞C to +/- 2∞C according to requirements. Dross resulting from exposure of molten solder to air may be removed manually but Solbraze manufacture a range of circular rotating pots, Rotadip Units, with automatic dross removal with the "Autoclean" wiping bar system available for rectangular pots ( see picture on Ultrasonic Soldering Baths page)
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CE
Marking - All solbraze equipment is manufactured and tested
to stringent specifications to meet current Health and Safety Standards.